KHP®102M (CuNiSi) / UNS C19005

Standard designations

EN not standardised / UNS C19005

Chemical composition
Cu	Rest
Ni [%]	1.5
Si [%]	0.3
Sn [%]	0.2
Zn [%]	0.4

Description / applications

KHP®102M is a CuNiSi material with excellent adhesion of tin layers at elevated operating temperatures. KHP®102M has an excellent combination of high conductivity and good mechanical properties.

Physical properties¹
Density	8.9 g/cm³
Electrical conductivity	33 (27²) m/Ω·mm² 57 (46²)% IACS³
Thermal conductivity	245 (1832) W/m·K
Thermal expansion coefficient	16.8·10-6/K
E modulus	127 GPa⁴
Approximate values in soft state, measured at ambient temperature ²for state R580/R580S ³IACS = International Annealed Copper Standard ⁴1 GPa = 1 kN/mm²

Processing information
Weldability	good
Solderability	good
Stress crack corrosion	none

Mechanical properties
Condition	Tensile strength Rm [MPa]	Yield strength Rp0.2 [MPa]	Elongation A50 [%]	Hardness HV
R360	360-430	min. 250	min. 12	100-130
R410	410-480	min. 360	min. 10	130-150
R460	460-530	min. 430	min. 8	140-160
R520	520-580	min. 490	min. 5	150-170
R580	580-650	min. 540	min. 8	175-205
R580S	580-650	min. 520	min. 10	175-205

More information

Datasheets

File type

KHP®102M (CuNiSi)

PDF (298.80 KB)