Alloys

Cu-ETP

Standard designations

EN CW004A / UNS C11000

Chemical composition
Cu [%] min. 99.9
O [%] max. 0.04
Description / applications

Cu-ETP is the most frequently used material in electronics. It is good for cold forming and soft soldering. Applications: electronics, stamped parts, switching elements, connectors, relay connections

Physical properties¹
Density 8.9 g/cm³
Electrical conductivity 58 m/Ω·mm²
100% IACS²
Thermal conductivity 385 W/m·K
Thermal expansion coefficient 17.7·10-6/K
E modulus 130 GPa³
¹Approximate values in soft state, measured at ambient temperature
²IACS = International Annealed Copper Standard
³1 GPa = 1 kN/mm²
Processing information
Weldability medium
Solderability medium
Stress crack corrosion none
Mechanical properties
Condition Tensile strength Rm [MPa] Yield strength Rp0.2 [MPa] Elongation
A50 [%]		 Hardness
HV
R200/H40 200-250 max. 100 min. 33 40-65
R220/H40 220-260 min. 140 min. 33 40-65
R240/H65 240-300 min. 180 min. 8 65-95
R290/H90 290-360 min. 250 min. 4 90-110
R360/H110 min. 360 min. 320 min. 2 min. 110

More information

Datasheet
File type
Cu-ETP
PDF (103.73 KB)