CuSn8 HP
high performance
Standard designation
EN CW453K / UNS C52100
| Chemical composition | |
|---|---|
| Cu | Rest |
| Sn [%] | 8 |
| P [%] | 0.1 |
Description / applications
CuSn8 HP is one of the copper-tin alloys. CuSn8 HP combines high strength with good electrical properties. CuSn8 HP is especially malleable due to its fine-grained structure. Applications: components for the electronics industry, connectors, contact springs, relay springs, leaf springs, switching elements
| Physical properties¹ | |
|---|---|
| Density | 8.8 g/cm³ |
| Electrical conductivity | 7.5 m/Ω·mm² 13% IACS² |
| Thermal conductivity | 62 W/m·K |
| Thermal expansion coefficient | 18.5·10-6/K |
| E modulus | 115 GPa |
| ¹Approximate values in soft state, measured at ambient temperature ² IACS = International Annealed Copper Standard |
| Processing information | |
|---|---|
| Weldability | good |
| Solderability | very good |
| Stress crack corrosion | none |
| Mechanical properties | |||||
|---|---|---|---|---|---|
| Condition | Tensile strength Rm [MPa] | Yield strength Rp0.2 [MPa] | Elongation A50 [%] |
Hardness HV |
|
| R685 | 685-785 | min. 580 | min. 15 | - | |
| R785 | min. 785 | min. 700 | min. 10 | - |