CuSn8
Standard designation
EN CW453K / UNS C52100
| Chemical composition | |
|---|---|
| Cu | Rest |
| Sn [%] | 8 |
| P [%] | 0.1 |
Description / applications
CuSn8 is one of the copper-tin alloys. CuSn8 combines high strength with good electrical properties. Applications: components for the electronics industry, connectors, contact springs, relay springs, leaf springs, switching elements
| Physical properties¹ | |
|---|---|
| Density | 8.8 g/cm³ |
| Electrical conductivity | 7.5 m/Ω·mm² 13% IACS² |
| Thermal conductivity | 62 W/m·K |
| Thermal expansion coefficient | 18.5·10-6/K |
| E modulus | 115 GPa |
| ¹Approximate values in soft state, measured at ambient temperature ² IACS = International Annealed Copper Standard |
| Processing information | |
|---|---|
| Weldability | good |
| Solderability | very good |
| Stress crack corrosion | none |
| Mechanical properties | |||||
|---|---|---|---|---|---|
| Condition | Tensile strength Rm [MPa] | Yield strength Rp0.2 [MPa] | Elongation A50 [%] |
Hardness HV |
|
| R370/H90 | 370-450 | max. 300 | min. 50 | 90-120 | |
| R450/H135 | 450-550 | min. 280 | min. 20 | 135-175 | |
| R540/H170 | 540-630 | min. 460 | min. 13 | 170-200 | |
| R600/H190 | 600-690 | min. 530 | min. 5 | 190-220 | |
| R660/H210 | 660-750 | min. 620 | min. 3 | 210-240 | |
| R740/H230 | 740-830 | min. 700 | min. 2 | 230-260 | |
| R810/H240 | min. 810 | min. 770 | - | min. 240 |