Alloys

Cu-PHC

Standard designations

EN CW020A / UNS C10300

Chemical composition
Cu [%] min. 99.95
P [%] 0.003
oxygen-free
Description / applications

Cu-PHC is an oxygen-free copper, phosphorous deoxydised copper. It is good for cold forming and soft soldering. Applications: Electronics, switching elements, connectors

Physical properties¹
Density 8.9 g/cm³
Electrical conductivity 58 m/Ω·mm²
100% IACS²
Thermal conductivity 385 W/m·K
Thermal expansion coefficient 17.7·10-6/K
E modulus 130 GPa³
¹Approximate values in soft state, measured at ambient temperature
²IACS = International Annealed Copper Standard
³1 GPa = 1 kN/mm²
Processing information
Weldability very good
Solderability very good
Stress crack corrosion none
Mechanical properties
Condition Tensile strength Rm [MPa] Yield strength Rp0.2 [MPa] Elongation
A50 [%]		 Hardness
HV
R200/H40 200-250 max. 100 min. 33 40-65
R220/H40 220-260 max. 140 min. 33 40-65
R240/H65 240-300 min. 180 min. 8 65-95
R290/H90 290-360 min. 250 min. 4 90-110
R360/H110 min. 360 min. 320 min. 2 min. 110

More information

Datasheet
File type
Cu-PHC
PDF (103.41 KB)