Cu-OF
Standard designations
EN CW008A / UNS C10200
| Chemical composition | |
|---|---|
| Cu [%] | min. 99.95 |
| oxygen-free |
Description / applications
Cu-OF is an oxygen-free copper alloy produced without the addition of deoxidizing agents. It is well suited for cold forming and thermal joining processes. Applications: electrical devices, switching elements, connectors
| Physical properties¹ | |
|---|---|
| Density | 8.9 g/cm³ |
| Electrical conductivity | 58 m/Ω·mm² 100% IACS² |
| Thermal conductivity | 392 W/m·K |
| Thermal expansion coefficient | 17.7·10-6/K |
| E modulus | 127 GPa |
| ¹Approximate values in soft state, measured at ambient temperature ²IACS = International Annealed Copper Standard |
| Processing information | |
|---|---|
| Weldability | good |
| Solderability | good |
| Stress crack corrosion | none |
| Mechanical properties | |||||
|---|---|---|---|---|---|
| Condition | Tensile strength Rm [MPa] | Yield strength Rp0.2 [MPa] | Elongation A50 [%] |
Hardness HV |
|
| R220/H40 | 220-260 | max. 140 | min. 33 | 40-70 | |
| R240/H65 | 240-300 | min. 180 | min. 8 | 65-95 | |
| R290/H90 | 290-360 | min. 250 | min. 4 | 90-110 | |
| R360/H110 | min. 360 | min. 320 | min. 2 | min. 110 |