Cu-HCP
Standard designation
EN CW021A / UNS C10300
| Chemical composition | |
|---|---|
| Cu [%] | min. 99.95 |
| P [%] | 0.004 |
| oxygen-free |
Description / applications
Cu-HCP is an oxygen-free, phosphorus-deoxidized copper. Strips made of Cu-HCP are very well suited for cold forming and soft and hard soldering. Due to its phosphorus content, this copper grade is ideally suited for many welding applications. Applications: electrical devices, switching elements, connectors, longitudinal welded cables
| Physical properties¹ | |
|---|---|
| Density | 8.9 g/cm³ |
| Electrical conductivity | 57 m/Ω·mm² 98% IACS² |
| Thermal conductivity | 385 W/m·K |
| Thermal expansion coefficient | 17.7·10-6/K |
| E modulus | 127 GPa |
| ¹Approximate values in soft state, measured at ambient temperature ²IACS = International Annealed Copper Standard |
| Processing information | |
|---|---|
| Weldability | very good |
| Solderability | very good |
| Stress crack corrosion | none |
| Mechanical properties | |||||
|---|---|---|---|---|---|
| Condition | Tensile strength Rm [MPa] | Yield strength Rp0.2 [MPa] | Elongation A50 [%] |
Hardness HV |
|
| R220/H40 | 220-260 | max. 140 | min. 33 | 40-65 | |
| R240/H65 | 240-300 | min. 180 | min. 8 | 65-95 | |
| R290/H90 | 290-360 | min. 250 | min. 4 | 90-110 | |
| R360/H110 | min. 360 | min. 320 | min. 2 | min. 110 |