KHP®7026 (CuNi2Si)
Standard designation
EN CW 111C / UNS C70260
| Chemical composition | |
|---|---|
| Cu | Rest |
| Ni [%] | 2 |
| Si [%] | 0.6 |
Description / applications
KHP®7026 is one of the group of CuNiSi materials. KHP®7026 offers high strength combined with high electrical conductivity. Applications: connectors, contact blades, contact springs, switches, relays, lead frames
| Physical properties¹ | |
|---|---|
| Density | 8.8 g/cm³ |
| Electrical conductivity | 23 m/Ω·mm² 40% IACS²'³ |
| Thermal conductivity | 161 W/m·K |
| Thermal expansion coefficient | 17·10-6/K |
| E modulus | 130 GPa |
| ¹Approximate values in soft state, measured at ambient temperature ²IACS = International Annealed Copper Standard ³1 GPa = 1 kN/mm² |
| Processing information | |
|---|---|
| Weldability | good |
| Solderability | good |
| Stress crack corrosion | none |
| Mechanical properties | |||||
|---|---|---|---|---|---|
| Condition | Tensile strength Rm [MPa] | Yield strength Rp0.2 [MPa] | Elongation A50 [%] |
Hardness HV |
|
| R580/H120 | 580-660 | min. 520 | min. 12 | 175-205 | |
| R620/H170 | 620-710 | min. 540 | min. 10 | 190-215 | |
| R650/H200 | 650-730 | min. 570 | min. 7 | 195-225 | |
| R720/H220 | min. 720 | min. 650 | min. 3 | min. 215 |