KHP®7025 (CuNi3SiMg)
Standard designation
EN not standardised / UNS C70250
| Chemical composition | |
|---|---|
| Cu | Rest |
| Ni [%] | 3 |
| Si [%] | 0.65 |
| Mg [%] | 0.15 |
Description / applications
Applications: KHP®7025 is a CuNiSi material. KHP®7025 offers high electrical conductivity combined with high strength and good stress relaxation resistance. Applications: connectors, contact blades, contact springs, switches, relays, lead frames
| Physical properties¹ | |
|---|---|
| Density | 8.8 g/cm³ |
| Electrical conductivity | 23 - 29 m/Ω·mm² 40 - 50% IACS² |
| Thermal conductivity | 190 W/m·K |
| Thermal expansion coefficient | 17·10-6/K |
| E modulus | 130 GPa³ |
| ¹Approximate values in soft state, measured at ambient temperature ²IACS = International Annealed Copper Standard ³1 GPa = 1 kN/mm² |
| Processing information | |
|---|---|
| Weldability | good |
| Solderability | good |
| Stress crack corrosion | none |
| Mechanical properties | |||||
|---|---|---|---|---|---|
| Condition | Tensile strength Rm [MPa] | Yield strength Rp0.2 [MPa] | Elongation A50 [%] |
Hardness HV |
|
| R620 | 620-760 | min. 500 | min. 11 | 180-220 | |
| R650 | 650-780 | min. 585 | min. 10 | 200-240 | |
| R690 | 690-800 | min. 655 | min. 8 | 210-250 | |
| R760 | 760-860 | min. 700 | min. 7 | 220-260 |