KHP®15 (CuSn0.15)
Standard designation
EN CW117C/UNS C14415
| Chemical composition | |
|---|---|
| Cu | Rest |
| Sn [%] | 0.15 |
Description/applications
KHP®15 is a low-alloyed CuSn material. KHP®15 has high electrical conductivity and is harder than pure copper due to its tin content. Applications: Components for electronics and photovoltaics, lead frames, plug contacts, semiconductor elements
| Physical properties¹ | |
|---|---|
| Density | 8.9 g/cm³ |
| Electrical conductivity | 46 m/Ω·mm² 80% IACS² |
| Thermal conductivity | 300 W/m·K |
| Thermal expansion coefficient | 18·10 -6/K |
| E modulus | 130 GPa |
| ¹Approximate values in soft state, measured at ambient temperature ²IACS = International Annealed Copper Standard |
| Processing information | |
|---|---|
| Weldability | good |
| Solderability | good |
| Stress crack corrosion | none |
| Mechanical properties | |||||
|---|---|---|---|---|---|
| Condition | Tensile strength Rm [MPa] | Yield strength Rp0.2 [MPa] | Elongation A50 [%] |
Hardness HV |
|
| R2500/H60 | 250-320 | max. 200 | min. 9 | 60-90 | |
| R300/H85 | 300-370 | min. 250 | min. 4 | 85-110 | |
| R360/H105 | 360-430 | min. 300 | min. 3 | 105-130 | |
| R420/H120 | 420-490 | min. 350 | min. 2 | 120-140 |