KHP®109 (CuNi1Sn0.9)
Standard designation
EN not standardised / UNS C19025
| Chemical composition | |
|---|---|
| Cu | Rest |
| Ni [%] | 1 |
| Sn [%] | 0.9 |
| P [%] | 0.05 |
Description / applications
KHP®109 is a CuNiSn material. KHP®109 has high conductivity combined with good mechanical properties. Applications: connectors, contact springs, switches, relays, semiconductor carriers
| Physical properties¹ | |
|---|---|
| Density | 8.9 g/cm³ |
| Electrical conductivity | 23 m/Ω·mm² 40% IACS² |
| Thermal conductivity | 161 W/m·K |
| Thermal expansion coefficient | 17·10-6/K |
| E modulus | 130 GPa³ |
| ¹Approximate values in soft state, measured at ambient temperature ²IACS = International Annealed Copper Standard |
| Processing information | |
|---|---|
| Weldability | good |
| Solderability | good |
| Stress crack corrosion | none |
| Mechanical properties | |||||
|---|---|---|---|---|---|
| Condition | Tensile strength Rm [MPa] | Yield strength Rp0.2 [MPa] | Elongation A50 [%] |
Hardness HV |
|
| R335 | 335-470 | min. 315 | min. 15 | 120-155 | |
| R440 | 440-520 | min. 420 | min. 9 | 135-170 | |
| R500 | 500-570 | min. 480 | min. 5 | 155-180 | |
| R540 | 540-610 | min. 520 | min. 4 | 160-195 | |
| R580 | 580-650 | min. 560 | - | 175-210 | |
| R630 | 630-730 | min. 610 | - | min. 190 |