KHP®105 (CuNi1Sn0.5)
Standard designation
EN not standardised / UNS C19020
| Chemical composition | |
|---|---|
| Cu | Rest |
| Ni [%] | 1 |
| Sn [%] | 0.5 |
| P [%] | 0.05 |
Description / applications
KHP®105 is a copper-nickel-tin alloy. KHP®105 is characterised by high electrical conductivity and is good for cold forming. Applications: contact blades, relays, switches, central electrical systems, lead frames, semiconductor carriers
| Physical properties¹ | |
|---|---|
| Density | 8.9 g/cm³ |
| Electrical conductivity | 29 m/Ω·mm² 50% IACS² |
| Thermal conductivity | 197 W/m·K |
| Thermal expansion coefficient | 17·10-6/K |
| E modulus | 130 GPa |
| ¹Approximate values in soft state, measured at ambient temperature ²IACS = International Annealed Copper Standard |
| Processing information | |
|---|---|
| Weldability | good |
| Solderability | good |
| Stress crack corrosion | none |
| Mechanical properties | |||||
|---|---|---|---|---|---|
| Condition | Tensile strength Rm [MPa] | Yield strength Rp0.2 [MPa] | Elongation A50 [%] |
Hardness HV |
|
| R400 | 400-480 | min. 380 | min. 7 | 120-150 | |
| R450 | 450-510 | min. 430 | min. 5 | 130-155 | |
| R490 | 490-550 | min. 470 | min. 5 | 145-170 | |
| R530 | min. 530 | min. 510 | min. 4 | min. 155 |