KHP®102M (CuNiSi)
Standard designations
EN not standardised / UNS C19005
| Chemical composition | |
|---|---|
| Cu | Rest |
| Ni [%] | 1.5 |
| Si [%] | 0.3 |
| Sn [%] | 0.2 |
| Zn [%] | 0.4 |
Description / applications
KHP®102M is a CuNiSi material with excellent adhesion of tin layers at elevated operating temperatures. KHP®102M has an excellent combination of high conductivity and good mechanical properties.
| Physical properties¹ | |
|---|---|
| Density | 8.9 g/cm³ |
| Electrical conductivity | 33 (27²) m/Ω·mm² 57 (46²)% IACS³ |
| Thermal conductivity | 245 (1832) W/m·K |
| Thermal expansion coefficient | 16.8·10-6/K |
| E modulus | 127 GPa⁴ |
| Approximate values in soft state, measured at ambient temperature ²for state R580/R580S ³IACS = International Annealed Copper Standard ⁴1 GPa = 1 kN/mm² |
| Processing information | |
|---|---|
| Weldability | good |
| Solderability | good |
| Stress crack corrosion | none |
| Mechanical properties | |||||
|---|---|---|---|---|---|
| Condition | Tensile strength Rm [MPa] | Yield strength Rp0.2 [MPa] | Elongation A50 [%] |
Hardness HV |
|
| R360 | 360-430 | min. 250 | min. 12 | 100-130 | |
| R410 | 410-480 | min. 360 | min. 10 | 130-150 | |
| R460 | 460-530 | min. 430 | min. 8 | 140-160 | |
| R520 | 520-580 | min. 490 | min. 5 | 150-170 | |
| R580 | 580-650 | min. 540 | min. 8 | 175-205 | |
| R580S | 580-650 | min. 520 | min. 10 | 175-205 |