Cu-ETP is the most frequently used material in electronics. It is good for cold forming and soft soldering. Applications: electronics, stamped parts, switching elements, connectors, relay connections
Physical properties¹
Density
8.9 g/cm³
Electrical conductivity
58 m/Ω·mm² 100% IACS²
Thermal conductivity
385 W/m·K
Thermal expansion coefficient
17.7·10-6/K
E modulus
130 GPa³
¹Approximate values in soft state, measured at ambient temperature ²IACS = International Annealed Copper Standard ³1 GPa = 1 kN/mm²