Alloys

KHP®7026 (CuNi2Si)

Standard designation

EN CW 111C / UNS C70260

Chemical composition
Cu Rest
Ni [%] 2
Si [%] 0.6
Description / applications

KHP®7026 is one of the group of CuNiSi materials. KHP®7026 offers high strength combined with high electrical conductivity. Applications: connectors, contact blades, contact springs, switches, relays, lead frames

Physical properties¹
Density 8.8 g/cm³
Electrical conductivity 23 m/Ω·mm²
40% IACS²'³
Thermal conductivity 161 W/m·K
Thermal expansion coefficient 17·10-6/K
E modulus 130 GPa
¹Approximate values in soft state, measured at ambient temperature
²IACS = International Annealed Copper Standard
³1 GPa = 1 kN/mm²
Processing information
Weldability good
Solderability good
Stress crack corrosion none
Mechanical properties
Condition Tensile strength Rm [MPa] Yield strength Rp0.2 [MPa] Elongation
A50 [%]		 Hardness
HV
R580/H120 580-660 min. 520 min. 12 175-205
R620/H170 620-710 min. 540 min. 10 190-215
R650/H200 650-730 min. 570 min. 7 195-225
R720/H220 min. 720 min. 650 min. 3 min. 215

More information

Datasheet
File type
KHP®7026 (CuNi2Si)
PDF (299.10 KB)