Alloys

KHP®102 (CuNiSi)

Standard designation

EN not standardised / UNS C19010

Chemical composition
Cu Rest
Ni [%] 1.3
Si [%] 0.25
P [%] 0.03
Description / applications

KHP®102 is a CuNiSi material. KHP®102 has an excellent combination of high conductivity and good mechanical properties. Applications: connectors, contact blades, contact springs, switches, relays, lead frames

Physical properties¹
Density 8.9 g/cm³
Electrical conductivity 35 (29²) m/Ω·mm²
60 (50²)% IACS³
Thermal conductivity 260 (197²) W/m·K
Thermal expansion coefficient 16.8·10-6/K
E modulus 127 GPa⁴
¹Approximate values in soft state, measured at ambient temperature
² for state R580
³ IACS = International Annealed Copper Standard
⁴ 1 GPa = 1 kN/mm²
Processing information
Weldability good
Solderability good
Stress crack corrosion none
Mechanical properties
Condition Tensile strength Rm [MPa] Yield strength Rp0.2 [MPa] Elongation
A50 [%]		 Hardness
HV
R360 360-430 min. 250 min. 12 100-130
R410 410-480 min. 360 min. 10 130-150
R460 460-530 min. 430 min. 8 140-160
R520 520-580 min. 490 min. 5 150-170
R580 580-650 min. 540 min. 8 175-205
R580S 580-650 min. 520 min. 10 175-205

All information

Datasheet
File type
KHP®102 (CuNiSi)
PDF (298.50 KB)